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BAS116TT1G
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3
PACKAGE DIMENSIONS
SC?75/SOT?416
CASE 463?01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
0.20 (0.008)
M
D
?E?
?D?
b
3 PL
e
0.20 (0.008)
E
C
L
A
A1
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
3
2
1
HE
DIM MIN NOM MAX
MILLIMETERS
A
0.70 0.80 0.90
A1
0.00 0.05 0.10
b
C
0.10 0.15 0.25
D
1.55 1.60 1.65
E
e
1.00 BSC
0.027 0.031 0.035
0.000 0.002 0.004
0.004 0.006 0.010
0.059 0.063 0.067
0.04 BSC
MIN NOM MAX
INCHES
0.15 0.20 0.30
0.006 0.008 0.012
HE
L
0.10 0.15 0.20
1.50 1.60 1.70
0.004 0.006 0.008
0.061 0.063 0.065
0.70 0.80 0.90
0.027 0.031 0.035
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm
inches
0.356
0.014
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.803
0.071
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e changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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BAS116TT1/D
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